PART |
Description |
Maker |
1N5711 1N5711UBCA 1N5711UBCC 1N5711UBD |
SCHOTTKY BARRIER DIODES LEADLESS PACKAGE FOR SURFACE MOUNT
|
Microsemi Corporation
|
1N747AUR-1 1N748AUR-1 1N755AUR-1 1N749AUR-1 1N758A |
SPI/MICROWIRE-Compatible UART in QSOP-16 LEADLESS PACKAGE FOR SURFACE MOUNT
|
MICROSEMI[Microsemi Corporation]
|
HFR-RFTS250LFC50OHM-F-0E0 HFR-RFTS250LFC50OHM-F-0F |
0 MHz - 3000 MHz 50 ohm RF/MICROWAVE TERMINATION ROHS COMPLIANT, LEADLESS PACKAGE-2 High Power, Surface Mount RF Terminators
|
IRC Advanced Film IRC - a TT electronics Company.
|
NTLMS4501N |
Power MOSFET 30 V, 14.7 A, N-Channel, SO-8 Leadless Package
|
ON Semiconductor
|
CTLM7410-M832D |
1 A, 25 V, 2 CHANNEL, PNP, Si, POWER TRANSISTOR 3 X 2 MM, LEADLESS PACKAGE-10
|
Central Semiconductor, Corp.
|
J68.APACKAGE |
68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
|
Intersil Corporation
|
MGF4851A |
SUPER LOW NOISE InGaAs HEMT (Leadless Ceramic Package)
|
Mitsubishi Electric Semiconductor
|
MGF4953B |
SUPER LOW NOISE InGaAs HEMT Leadless Ceramic Package
|
Mitsubishi Electric Semiconductor
|
MSD621 MSD621-100.00M |
LEADLESS SURFACE MOUNT HCMOS CLOCK OSCILLATOR
|
Connor-Winfield Corporation
|
PMEG4002EL |
40V, 0.2 A LOW V-f MEGA SCHOTTKY BARRIER RECTIFIER IN LEADLESS ULTRA SMALL SOD882 PACKAGE
|
NXP Semiconductors PHILIPS[Philips Semiconductors]
|
CTLSH5-40M833 |
SURFACE MOUNT LOW VF SILICON SCHOTTKY RECTIFIER TINY LEADLESS MODULE
|
CENTRAL[Central Semiconductor Corp]
|